打孔后，铜离子如何进一步破坏细胞？

After punching holes, how do copper ions further damage the cell?

既然细胞的主要防御（它的外膜）已经被破坏，就会有一股不受阻碍的铜离子流进入细胞。这使细胞内的几个重要过程处于危险之中。铜确实淹没了细胞内部并阻碍了细胞新陈代谢（即生命所需的生化反应）。这些反应由酶完成和催化。当过量的铜离子与这些酶结合时，它们的活性就会停止。细菌不能再“呼吸”、“吃”、“消化”或“产生能量”。

Now that the cells main defense (its outer envelope) has been breached, there is an unopposed stream of copper ions entering the cell. This puts several vital processes inside the cell in danger. Copper literally overwhelms the inside of the cell and obstructs cell metabolism (i.e., the biochemical reactions needed for life). These reactions are accomplished and catalyzed by enzymes. When excess copper binds to these enzymes, their activity grinds to a halt. The bacterium can no longer "breathe", "eat", "digest" or "create energy."

铜的作用为何如此之快，并影响如此广泛的微生物？

How can copper's effect be so fast, and affect such a wide range of microorganisms?

专家通过铜作用的多目标性质解释了细菌在铜表面上的死亡速度。膜穿孔后，铜可以抑制任何“挡道”的特定酶，并阻止细胞运输或消化营养物质、修复受损的膜、呼吸或繁殖。

Experts explain the speed with which bacteria perish on copper surfaces by the multi-targeted nature of copper's effects. After membrane perforation,