铝对任何真菌都没有影响。这些发现显示出优于铝表面的优势，因为铜具有抑制引起异味的霉菌生长的固有能力。

Heating Ventilating and Air Conditioning (HVAC) system components operate in warm, dark, humid environments that are ideal breeding grounds for mold and mildew that cause odors and can inhibit system efficiency. Laboratory testing1> on odor-causing mold and mildew has shown that copper materials can inhibit the growth of these organisms. After 24 hours of exposure to copper surfaces, total die off was observed in several common mold species. Aluminum had no effect on any of the fungi. These findings show the advantage over aluminum surfaces because of copper's inherent ability to inhibit the growth of odor-causing mold.

为了支持实验室数据，南卡罗来纳大学构建了一个试点规模的系统，该系统由远程医疗和先进技术研究中心（TATRC）下的国防部（DoD）资助。该计划旨在验证通过在这些系统中使用铜组件来提高HVAC系统性能的概念。实验装置将铜热交换器、滴油盘和其他组件与铝制对应物进行比较。此外，插入热交换器翅片之间的铜和铝试样将定期移除以观察生物膜的生长。数据收集始于2009 年12月。

To support the laboratory data, a pilot-scale system was constructed at the University of South Carolina, funded by the Department of Defense (DoD) under the Telemedicine and Advanced Technology Research Center (TATRC). This program seeks to validate the concept of improved HVAC system performance through copper component use in these systems. The experimental setup will compare copper heat exchangers, drip pans and other components to their aluminum counterparts. Additionally, copper and aluminum coupons inserted in between heat exchanger fins will be removed periodically to observe biofilm growth.